Rouhi, S. Et Al. 2021. In-situ thin film copper-copper thermocompression bonding for quantum cascade lasers. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.32, no.11 , 15605-15614.

Rouhi, S., Ozdemir, M., Ekmekcioglu, M., Yigen, S., Demirhan, Y., Szerling, A., ... Kosiel, K.(2021). In-situ thin film copper-copper thermocompression bonding for quantum cascade lasers. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.32, no.11, 15605-15614.

Rouhi, Sina Et Al. "In-situ thin film copper-copper thermocompression bonding for quantum cascade lasers," JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.32, no.11, 15605-15614, 2021

Rouhi, Sina Et Al. "In-situ thin film copper-copper thermocompression bonding for quantum cascade lasers." JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.32, no.11, pp.15605-15614, 2021

Rouhi, S. Et Al. (2021) . "In-situ thin film copper-copper thermocompression bonding for quantum cascade lasers." JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.32, no.11, pp.15605-15614.

@article{article, author={Sina Rouhi Et Al. }, title={In-situ thin film copper-copper thermocompression bonding for quantum cascade lasers}, journal={JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS}, year=2021, pages={15605-15614} }