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Proceeding of 5th International Conference on Advances in Manufacturing and Materials Engineering
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F. Yüksel Et Al. , "Deposition of Nb Doped CrYN Thin Films: Investigation of Structural, Mechanical and Tribological Properties ," In Proceeding of 5th International Conference on Advances in Manufacturing and Materials Engineering , Singapore: Springer Singapore, 2023, pp.1-667.

Yüksel, F. Et Al. Deposition of Nb Doped CrYN Thin Films: Investigation of Structural, Mechanical and Tribological Properties . 2023. In Proceeding of 5th International Conference on Advances in Manufacturing and Materials Engineering , Springer Singapore, Singapore, 1-667.

Yüksel, F., Gülten, G., Yaylalı, B., Totik, Y., & Efeoğlu, İ., (2023). Deposition of Nb Doped CrYN Thin Films: Investigation of Structural, Mechanical and Tribological Properties . Proceeding of 5th International Conference on Advances in Manufacturing and Materials Engineering (pp.1-667), Singapore: Springer Singapore.

Yüksel, Furkan Et Al. "Deposition of Nb Doped CrYN Thin Films: Investigation of Structural, Mechanical and Tribological Properties ." In Proceeding of 5th International Conference on Advances in Manufacturing and Materials Engineering , 1-667. Singapore: Springer Singapore, 2023

Yüksel, Furkan Et Al. "Deposition of Nb Doped CrYN Thin Films: Investigation of Structural, Mechanical and Tribological Properties ." Proceeding of 5th International Conference on Advances in Manufacturing and Materials Engineering , Springer Singapore, 2023, pp.1-667.

Yüksel, F. Et Al. (2023) "Deposition of Nb Doped CrYN Thin Films: Investigation of Structural, Mechanical and Tribological Properties ", Proceeding of 5th International Conference on Advances in Manufacturing and Materials Engineering . Singapore: Springer Singapore.

@bookchapter{bookchapter, author ={Furkan Yüksel Et Al. }, chaptertitle={Deposition of Nb Doped CrYN Thin Films: Investigation of Structural, Mechanical and Tribological Properties }, booktitle={ Proceeding of 5th International Conference on Advances in Manufacturing and Materials Engineering}, publisher={Springer Singapore}, city={Singapore},year={2023} }