M. ERTUĞRUL Et Al. , "Low Cost and Easy to Implementable Package of SiC Diodefor High Temperature Applications," 57th Electronic Materials Conference , Columbus, United States Of America, 2015
ERTUĞRUL, M. Et Al. 2015. Low Cost and Easy to Implementable Package of SiC Diodefor High Temperature Applications. 57th Electronic Materials Conference , (Columbus, United States Of America).
ERTUĞRUL, M., TATAR, D., SÖNMEZ, E., MAVİ, A., & BALTA, V., (2015). Low Cost and Easy to Implementable Package of SiC Diodefor High Temperature Applications . 57th Electronic Materials Conference, Columbus, United States Of America
ERTUĞRUL, Mehmet Et Al. "Low Cost and Easy to Implementable Package of SiC Diodefor High Temperature Applications," 57th Electronic Materials Conference, Columbus, United States Of America, 2015
ERTUĞRUL, Mehmet Et Al. "Low Cost and Easy to Implementable Package of SiC Diodefor High Temperature Applications." 57th Electronic Materials Conference , Columbus, United States Of America, 2015
ERTUĞRUL, M. Et Al. (2015) . "Low Cost and Easy to Implementable Package of SiC Diodefor High Temperature Applications." 57th Electronic Materials Conference , Columbus, United States Of America.
@conferencepaper{conferencepaper, author={Mehmet ERTUĞRUL Et Al. }, title={Low Cost and Easy to Implementable Package of SiC Diodefor High Temperature Applications}, congress name={57th Electronic Materials Conference}, city={Columbus}, country={United States Of America}, year={2015}}