DEPOSITION OF GRADED ALLOY NITRIDE FILMS BY CLOSED FIELD UNBALANCED MAGNETRON SPUTTERING

MONAGHAN D., TEER D., LAING K., EFEOGLU I., ARNELL R.

SURFACE & COATINGS TECHNOLOGY, cilt.59, ss.21-25, 1993 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 59
  • Basım Tarihi: 1993
  • Doi Numarası: 10.1016/0257-8972(93)90049-t
  • Dergi Adı: SURFACE & COATINGS TECHNOLOGY
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.21-25
  • Atatürk Üniversitesi Adresli: Evet

Özet

The development of a deposition system based on closed field unbalanced magnetron sputter ion plating (uniform deposition and plasma), has greatly increased the number of complex nitrides that it is possible to routinely deposit. The new alloy nitrides can increase the hardness of standard TiN by a factor of 2, and can consequently result in longer tool life, In order to maintain high levels of coating to substrate adhesion, it is necessary to gradually grade the composition of the film in the interface region. Grading of an alloy nitride such as TiZrN will ensure minimum L(c) scratch adhesion levels of 75 N. The technique can be closely controlled and is very flexible, enabling the changes in composition to be attained with precision.