Akademik Veri Yönetim Sistemi
HEAT AND MASS TRANSFER, cilt.51, sa.2, ss.251-263, 2015 (SCI-Expanded)
Electronic equipment generally uses heat sinks as cooling devices in order to effectively control heat arising from them. The heat sinks are commonly installed in the restricted space of the systems and their thermal performance can be improved both by enhancing the heat transfer rate and by reducing the friction factor. In the present work, a study is made to investigate the thermal performance characteristics of "S-shaped" enhancement elements. Response surface methodology is used to plan and analyze the experiments. The element height, the transverse pitch, the element radius, and the Reynolds number are chosen as variables to study the thermal performance in terms of the Nusselt number and the friction factor. In order to verify the adequacy of the model used, confirmation experiments are performed on the experimental setup. The experimental results indicate that the model used in this study is reasonable and accurate and can be used for determining the Nusselt number and the friction factor with the limitations of the factors analyzed.